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Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Shrotriya, P. (author) / Sottos, N. R. (author)
POLYMER COMPOSITES ; 19 ; 567-578
1998-01-01
12 pages
Article (Journal)
English
DDC:
620.192
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