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Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
Shrotriya, P. (Autor:in) / Sottos, N. R. (Autor:in)
POLYMER COMPOSITES ; 19 ; 567-578
01.01.1998
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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