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A platform for research: civil engineering, architecture and urbanism
Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analyses of Microelectronics Devices
Han, B. (author)
EXPERIMENTAL MECHANICS ; 38 ; 278-288
1998-01-01
11 pages
Article (Journal)
English
DDC:
620.1
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