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Thermo-Mechanical Characterizations of High Density Interconnects

Bin, C. / Sheng, L. / Ling, S. / Yifan, G.

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Thermo-Mechanical Characterizations of High Density Interconnects

Bin, C. / Sheng, L. / Ling, S. / Yifan, G.

Thermo-Mechanical Characterizations of High Density Interconnects

Bin, C. / Sheng, L. / Ling, S. / Yifan, G.

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Export, share and cite

Document information

Title:

Thermo-Mechanical Characterizations of High Density Interconnects

Contributors:

Bin, C. (author) / Sheng, L. (author) / Ling, S. (author) / Yifan, G. (author)

Published in:

ADVANCING MICROELECTRONICS ; 26 ; 16

Publication date:

1999-01-01

Size:

16 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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