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Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films
Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films
Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films
Brueckner, W. (author) / Pitschke, W. (author) / Baunack, S. (author) / Thomas, J. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 14 ; 1286-1294
1999-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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