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    The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

    New search for: Joo, Y.-C.
    New search for: Hwang, S.-J.
    New search for: Park, H.

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    The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

    New search for: Joo, Y.-C.
    New search for: Hwang, S.-J.
    New search for: Park, H.

    Access

    Access via TIB
    Check availability in my library
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    The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

    New search for: Joo, Y.-C.
    New search for: Hwang, S.-J.
    New search for: Park, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

    Contributors:

    Joo, Y.-C. (author) / Hwang, S.-J. (author) / Park, H. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 426/432 ; 3481-3486

    Publication date:

    2003-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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