Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Utilisation of Cu(hfac)tmvs precursor gas in LCVD integrated circuit repair system

    New search for: Leppaevuori, S.
    New search for: Remes, J.
    New search for: Moilanen, H.
    New search for: Boyd, I. W.
    New search for: Perriere, J.
    New search for: Stuke, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Utilisation of Cu(hfac)tmvs precursor gas in LCVD integrated circuit repair system

    New search for: Leppaevuori, S.
    New search for: Remes, J.
    New search for: Moilanen, H.
    New search for: Boyd, I. W.
    New search for: Perriere, J.
    New search for: Stuke, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Utilisation of Cu(hfac)tmvs precursor gas in LCVD integrated circuit repair system

    New search for: Leppaevuori, S.
    New search for: Remes, J.
    New search for: Moilanen, H.
    New search for: Boyd, I. W.
    New search for: Perriere, J.
    New search for: Stuke, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Utilisation of Cu(hfac)tmvs precursor gas in LCVD integrated circuit repair system

    Contributors:

    Leppaevuori, S. (author) / Remes, J. (author) / Moilanen, H. (author) / Boyd, I. W. / Perriere, J. / Stuke, M.

    Published in:

    Proceedings of Symposium G on Surface Processing: Laser, Lamp, Plasma of the 1998 E-MRS Spring Conference - Strasbourg, France, June 16-1998 ; 123-129

    APPLIED SURFACE SCIENCE ; 138/139

    Publication date:

    1999-01-01

    Size:

    7 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Excimer laser-induced deposition of copper from Cu(hfac)(TMVS)

    Izquierdo, R. / Bertomeu, J. / Suys, M. et al. | British Library Online Contents | 1995

    Hybrid LCVD of micro-metallic lines for TFT-LCD circuit repair

    Park, J. B. / Kim, C. J. / Shin, P. E. et al. | British Library Online Contents | 2006

    Examining the `risks' of overspecifying TMVs

    British Library Online Contents | 2014

    Laser-induced metal-organic chemical vapor deposition (MOCVD) of Cu(hfac)(TMVS) on amorphous Teflon AF1600: an XPS study of the interface

    Popovici, D. / Czeremuzkin, G. / Meunier, M. et al. | British Library Online Contents | 1998

    TMVs Safely Regulate Water Temperatures in Challenging Commercial Applications

    British Library Online Contents | 2007

    Back to top