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    Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

    New search for: Li, H.
    New search for: Li, J.
    New search for: Wang, Z.
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    New search for: Wang, D.

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    Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

    New search for: Li, H.
    New search for: Li, J.
    New search for: Wang, Z.
    New search for: Jiang, C.
    New search for: Wang, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

    New search for: Li, H.
    New search for: Li, J.
    New search for: Wang, Z.
    New search for: Jiang, C.
    New search for: Wang, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

    Contributors:

    Li, H. (author) / Li, J. (author) / Wang, Z. (author) / Jiang, C. (author) / Wang, D. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 15 ; 117-120

    Publication date:

    1999-01-01

    Size:

    4 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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