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Pulse plating effects during Ni-W electrodeposition

Lee, S.-L. / Lee, Y.-F. / Chang, M.-H. / Lin, J.-C.

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Pulse plating effects during Ni-W electrodeposition

Lee, S.-L. / Lee, Y.-F. / Chang, M.-H. / Lin, J.-C.

Pulse plating effects during Ni-W electrodeposition

Lee, S.-L. / Lee, Y.-F. / Chang, M.-H. / Lin, J.-C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Pulse plating effects during Ni-W electrodeposition

Contributors:

Lee, S.-L. (author) / Lee, Y.-F. (author) / Chang, M.-H. (author) / Lin, J.-C. (author)

Published in:

CORROSION PREVENTION AND CONTROL ; 46 ; 71-75

Publication date:

1999-01-01

Size:

5 pages

ISSN:

0010-9371

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11223

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