A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Shen, M. H. (author) / Chao, C. K. (author)
JOURNAL OF THERMAL STRESSES ; 22 ; 637-658
1999-01-01
22 pages
Article (Journal)
English
DDC:
620.1121
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