Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Thermal Stresses for Bonded Dissimilar Materials with a Circular-Arc Anticrack
Shen, M. H. (Autor:in) / Chao, C. K. (Autor:in)
JOURNAL OF THERMAL STRESSES ; 22 ; 637-658
01.01.1999
22 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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