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Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Zhao, Y. / Basaran, C. / Cartwright, A. / Dishongh, T.

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Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Zhao, Y. / Basaran, C. / Cartwright, A. / Dishongh, T.

Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Zhao, Y. / Basaran, C. / Cartwright, A. / Dishongh, T.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Contributors:

Zhao, Y. (author) / Basaran, C. (author) / Cartwright, A. (author) / Dishongh, T. (author)

Published in:

JOURNAL OF THE MECHANICAL BEHAVIOR OF MATERIALS ; 10 ; 135-146

Publication date:

1999-01-01

Size:

12 pages

ISSN:

0334-8938

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669 / 016

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