Electroless Metal Deposition for Back-End 23 Wafer Processes: Fid-Bau Portal

Electroless Metal Deposition for Back-End 23 Wafer Processes

Ostmann, A. / Jauernig, C. / Dombrowski, C. / Kloeser, J. / Aschenbrenner, R. / Reichl, H.

Access

Page navigation

Export, share and cite

Electroless Metal Deposition for Back-End 23 Wafer Processes

Ostmann, A. / Jauernig, C. / Dombrowski, C. / Kloeser, J. / Aschenbrenner, R. / Reichl, H.

Electroless Metal Deposition for Back-End 23 Wafer Processes

Ostmann, A. / Jauernig, C. / Dombrowski, C. / Kloeser, J. / Aschenbrenner, R. / Reichl, H.

Access

Page navigation

Export, share and cite

Document information

Title:

Electroless Metal Deposition for Back-End 23 Wafer Processes

Contributors:

Published in:

ADVANCING MICROELECTRONICS ; 26 ; 23-26

Publication date:

1999-01-01

Size:

4 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

Mak, C. Y. | British Library Online Contents | 1994

Abrantes, L. M. / Correia, J. P. | British Library Online Contents | 1998

Xie, G. / Wang, Z. / Li, G. et al. | British Library Online Contents | 2007

Zhang, J.-Y. / Boyd, I. W. / Esrom, H. | British Library Online Contents | 1997

Scidone, L. / Diliberto, S. / Stein, N. et al. | British Library Online Contents | 2005