A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Khanna, P.K. (author) / Bhatnagar, S.K. (author) / Gust, W. (author)
MATERIALS LETTERS ; 40 ; 170-174
1999-01-01
5 pages
Article (Journal)
English
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