Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Surface studies of interconnecting zones for selective-area sealing of hybrid microcircuits using isothermal solidification process
Khanna, P.K. (Autor:in) / Bhatnagar, S.K. (Autor:in) / Gust, W. (Autor:in)
MATERIALS LETTERS ; 40 ; 170-174
01.01.1999
5 pages
Aufsatz (Zeitschrift)
Englisch
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