Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint: Fid-Bau Portal

Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Liu, H. / Feng, J. / Qian, Y. / Li, Z.

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Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Liu, H. / Feng, J. / Qian, Y. / Li, Z.

Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Liu, H. / Feng, J. / Qian, Y. / Li, Z.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Interface structure and formation mechanism of diffusion-bonded SiC/TiAl joint

Contributors:

Liu, H. (author) / Feng, J. (author) / Qian, Y. (author) / Li, Z. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 1011-1012

Publication date:

1999-01-01

Size:

2 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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