Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint: Fid-Bau Portal

Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint

Jicai, F. / Huijie, L. / Naka, M. / Schuster, J. C.

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Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint

Jicai, F. / Huijie, L. / Naka, M. / Schuster, J. C.

Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint

Jicai, F. / Huijie, L. / Naka, M. / Schuster, J. C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint

Contributors:

Jicai, F. (author) / Huijie, L. (author) / Naka, M. (author) / Schuster, J. C. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 20 ; 301-302

Publication date:

2001-01-01

Size:

2 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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