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    Analytical Modelling of Solidification During Temperature Gradient TLP Diffusion Bonding

    New search for: Shirzadi, A. A.
    New search for: Wallach, E. R.

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    Analytical Modelling of Solidification During Temperature Gradient TLP Diffusion Bonding

    New search for: Shirzadi, A. A.
    New search for: Wallach, E. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analytical Modelling of Solidification During Temperature Gradient TLP Diffusion Bonding

    New search for: Shirzadi, A. A.
    New search for: Wallach, E. R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Analytical Modelling of Solidification During Temperature Gradient TLP Diffusion Bonding

    Contributors:

    Shirzadi, A. A. (author) / Wallach, E. R. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 329/330 ; 351-360

    Publication date:

    2000-01-01

    Size:

    10 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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