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Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials
Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials
Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials
Iwasaki, T. (author)
2000-01-01
9 pages
Article (Journal)
English
DDC:
621
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Molecular dynamics analysis of adhesion strength of interfaces between thin films
| British Library Online Contents | 2001