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    Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates

    New search for: Wu, Y.-J.
    New search for: Takatoya, T.
    New search for: Chung, K.
    New search for: Seferis, J. C.
    New search for: Ahn, K.

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    Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates

    New search for: Wu, Y.-J.
    New search for: Takatoya, T.
    New search for: Chung, K.
    New search for: Seferis, J. C.
    New search for: Ahn, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates

    New search for: Wu, Y.-J.
    New search for: Takatoya, T.
    New search for: Chung, K.
    New search for: Seferis, J. C.
    New search for: Ahn, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates

    Contributors:

    Wu, Y.-J. (author) / Takatoya, T. (author) / Chung, K. (author) / Seferis, J. C. (author) / Ahn, K. (author)

    Published in:

    JOURNAL OF COMPOSITE MATERIALS ; 34 ; 1998-2015

    Publication date:

    2000-01-01

    Size:

    18 pages

    ISSN:

    0021-9983

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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