Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates
Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates
Development of the Transient Simulated Laminate (TSL) Methodology for Moisture Ingression Studies Using Unsymmetric Laminates
Wu, Y.-J. (Autor:in) / Takatoya, T. (Autor:in) / Chung, K. (Autor:in) / Seferis, J. C. (Autor:in) / Ahn, K. (Autor:in)
JOURNAL OF COMPOSITE MATERIALS ; 34 ; 1998-2015
01.01.2000
18 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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