Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial: Fid-Bau Portal

Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial

Kim, J. H. / Moon, H. J. / Earmme, Y. Y.

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Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial

Kim, J. H. / Moon, H. J. / Earmme, Y. Y.

Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial

Kim, J. H. / Moon, H. J. / Earmme, Y. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Inplane and antiplane T-stresses for an interface crack in anisotropic bimaterial

Contributors:

Kim, J. H. (author) / Moon, H. J. (author) / Earmme, Y. Y. (author)

Published in:

MECHANICS OF MATERIALS ; 33 ; 21-32

Publication date:

2001-01-01

Size:

12 pages

ISSN:

0167-6636

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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