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    Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

    New search for: Kwon, Y.-S.
    New search for: Kim, J.-S.
    New search for: Moon, J.-S.
    New search for: Suk, M.-J.

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    Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

    New search for: Kwon, Y.-S.
    New search for: Kim, J.-S.
    New search for: Moon, J.-S.
    New search for: Suk, M.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

    New search for: Kwon, Y.-S.
    New search for: Kim, J.-S.
    New search for: Moon, J.-S.
    New search for: Suk, M.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

    Contributors:

    Kwon, Y.-S. (author) / Kim, J.-S. (author) / Moon, J.-S. (author) / Suk, M.-J. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 35 ; 1917-1924

    Publication date:

    2000-01-01

    Size:

    8 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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