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    Transient liquid phase diffusion bonding of 8090 Al-Li alloy using copper interlayer

    New search for: Dunford, D. V.
    New search for: Partridge, P. G.

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    Transient liquid phase diffusion bonding of 8090 Al-Li alloy using copper interlayer

    New search for: Dunford, D. V.
    New search for: Partridge, P. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Transient liquid phase diffusion bonding of 8090 Al-Li alloy using copper interlayer

    New search for: Dunford, D. V.
    New search for: Partridge, P. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Transient liquid phase diffusion bonding of 8090 Al-Li alloy using copper interlayer

    Contributors:

    Dunford, D. V. (author) / Partridge, P. G. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 14 ; 422-428

    Publication date:

    1998-01-01

    Size:

    7 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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