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    Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

    New search for: Kohn, A.
    New search for: Eizenberg, M.
    New search for: Shacham-Diamand, Y.
    New search for: Sverdlov, Y.

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    Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

    New search for: Kohn, A.
    New search for: Eizenberg, M.
    New search for: Shacham-Diamand, Y.
    New search for: Sverdlov, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

    New search for: Kohn, A.
    New search for: Eizenberg, M.
    New search for: Shacham-Diamand, Y.
    New search for: Sverdlov, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

    Contributors:

    Kohn, A. (author) / Eizenberg, M. (author) / Shacham-Diamand, Y. (author) / Sverdlov, Y. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 302 ; 18 - 25

    Publication date:

    2001-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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