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    Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

    New search for: Kumar, A.
    New search for: Kumar, M.
    New search for: Kumar, D.

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    Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

    New search for: Kumar, A.
    New search for: Kumar, M.
    New search for: Kumar, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

    New search for: Kumar, A.
    New search for: Kumar, M.
    New search for: Kumar, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

    Contributors:

    Kumar, A. (author) / Kumar, M. (author) / Kumar, D. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 258 ; 7962-7967

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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