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The thermal shock behavior of alumina-copper composite

Wang, L. / Shi, J. L. / Lin, M. T. / Chen, H. R. / Yan, D. S.

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The thermal shock behavior of alumina-copper composite

Wang, L. / Shi, J. L. / Lin, M. T. / Chen, H. R. / Yan, D. S.

The thermal shock behavior of alumina-copper composite

Wang, L. / Shi, J. L. / Lin, M. T. / Chen, H. R. / Yan, D. S.

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Check availability in my library

Order at Subito €

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Document information

Title:

The thermal shock behavior of alumina-copper composite

Contributors:

Wang, L. (author) / Shi, J. L. (author) / Lin, M. T. (author) / Chen, H. R. (author) / Yan, D. S. (author)

Published in:

MATERIALS RESEARCH BULLETIN ; 36 ; 925-932

Publication date:

2001-01-01

Size:

8 pages

ISSN:

0025-5408

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11 / 620

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