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Residual Stress Development during Relamination of Woven Composite Circuit Boards
Residual Stress Development during Relamination of Woven Composite Circuit Boards
Residual Stress Development during Relamination of Woven Composite Circuit Boards
Shrotriya, P. (author) / Sottos, N. R. (author) / Skipor, A. F. (author)
JOURNAL OF COMPOSITE MATERIALS ; 35 ; 905-927
2001-01-01
23 pages
Article (Journal)
English
DDC:
620.118
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