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Residual Stress Development during Relamination of Woven Composite Circuit Boards
Residual Stress Development during Relamination of Woven Composite Circuit Boards
Residual Stress Development during Relamination of Woven Composite Circuit Boards
Shrotriya, P. (Autor:in) / Sottos, N. R. (Autor:in) / Skipor, A. F. (Autor:in)
JOURNAL OF COMPOSITE MATERIALS ; 35 ; 905-927
01.01.2001
23 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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