Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect: Fid-Bau Portal

Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

Liu, P. L. / Shang, J. K.

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Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

Liu, P. L. / Shang, J. K.

Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

Liu, P. L. / Shang, J. K.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect

Contributors:

Liu, P. L. (author) / Shang, J. K. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 1651-1659

Publication date:

2001-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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