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Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect
Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect
Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect
Liu, P. L. (author) / Shang, J. K. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 1651-1659
2001-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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