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    Fatigue crack propagation behavior of underfill materials in microelectronic packaging

    New search for: Zhang, J.

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    Fatigue crack propagation behavior of underfill materials in microelectronic packaging

    New search for: Zhang, J.

    Access

    Access via TIB
    Check availability in my library
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    Fatigue crack propagation behavior of underfill materials in microelectronic packaging

    New search for: Zhang, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Title:

    Fatigue crack propagation behavior of underfill materials in microelectronic packaging

    Contributors:

    Zhang, J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 314 ; 194 - 200

    Publication date:

    2001-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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