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    Elastoplastic Analysis of W-Cu Functionally Graded Materials Subjected to a Thermal Shock by Micromechanical Model

    New search for: Ueda, S.

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    Elastoplastic Analysis of W-Cu Functionally Graded Materials Subjected to a Thermal Shock by Micromechanical Model

    New search for: Ueda, S.

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    Elastoplastic Analysis of W-Cu Functionally Graded Materials Subjected to a Thermal Shock by Micromechanical Model

    New search for: Ueda, S.

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    Document information
    Title:

    Elastoplastic Analysis of W-Cu Functionally Graded Materials Subjected to a Thermal Shock by Micromechanical Model

    Contributors:

    Ueda, S. (author)

    Published in:

    JOURNAL OF THERMAL STRESSES ; 24 ; 631-650

    Publication date:

    2001-01-01

    Size:

    20 pages

    ISSN:

    0149-5739

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1121

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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