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    Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

    New search for: Zhao, J.
    New search for: Miyashita, Y.
    New search for: Mutoh, Y.

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    Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

    New search for: Zhao, J.
    New search for: Miyashita, Y.
    New search for: Mutoh, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

    New search for: Zhao, J.
    New search for: Miyashita, Y.
    New search for: Mutoh, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

    Contributors:

    Zhao, J. (author) / Miyashita, Y. (author) / Mutoh, Y. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FATIGUE ; 23 ; 723-731

    Publication date:

    2001-01-01

    Size:

    9 pages

    ISSN:

    0142-1123

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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