Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue: Fid-Bau Portal

Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

Nozaki, M. / Sakane, M. / Tsukada, Y.

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Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

Nozaki, M. / Sakane, M. / Tsukada, Y.

Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

Nozaki, M. / Sakane, M. / Tsukada, Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

Contributors:

Nozaki, M. (author) / Sakane, M. (author) / Tsukada, Y. (author)

Published in:

INTERNATIONAL JOURNAL OF FATIGUE ; 30 ; 1729-1736

Publication date:

2008-01-01

Size:

8 pages

ISSN:

0142-1123

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

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