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The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering
The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering
The enhancement of the adhesion of copper layers to Dow Cyclotene 3022 through metal sputtering
Yang, D. Q. (author) / Sacher, E. (author) / Griswold, E. M. (author) / Smith, G. (author)
APPLIED SURFACE SCIENCE ; 180 ; 200-208
2001-01-01
9 pages
Article (Journal)
English
DDC:
621.35
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