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Polyimide for flip chip packaging Improving image quality in photosensitive polyimide films
Polyimide for flip chip packaging Improving image quality in photosensitive polyimide films
Polyimide for flip chip packaging Improving image quality in photosensitive polyimide films
Werbaneth, P. (author) / Ross, S. (author) / Rousey-Seidel, M. (author)
ADVANCED PACKAGING ; 11 ; 33-40
2002-01-01
8 pages
Article (Journal)
English
DDC:
658.564
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