A platform for research: civil engineering, architecture and urbanism
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Kim, D. (author) / Lee, C. C. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 416 ; 74-79
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
British Library Online Contents | 2002
|Void-Free Fluxless Solder Bonding of CPV Solar Cells
British Library Online Contents | 2010
|Flip Chip Interconnect: Examining the Infrastructure
British Library Online Contents | 2014
|Polyimide for flip chip packaging Improving image quality in photosensitive polyimide films
British Library Online Contents | 2002
|Shear Strength of Fluxless Solder Joints between Sn and In Bumps
British Library Online Contents | 2005
|