A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Fluxless flip-chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
Kim, D. (author) / Lee, C. C. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 416 ; 74-79
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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