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    Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

    New search for: Yeung, B.
    New search for: Jang, J. W.

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    Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

    New search for: Yeung, B.
    New search for: Jang, J. W.

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    Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

    New search for: Yeung, B.
    New search for: Jang, J. W.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

    Contributors:

    Yeung, B. (author) / Jang, J. W. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE LETTERS ; 21 ; 723-726

    Publication date:

    2002-01-01

    Size:

    4 pages

    ISSN:

    0261-8028

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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