Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows: Fid-Bau Portal

Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Koo, J. M. / Lee, Y. H. / Kim, S. K. / Jeong, M. Y. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Koo, J. M. / Lee, Y. H. / Kim, S. K. / Jeong, M. Y. / Jung, S. B.

Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Koo, J. M. / Lee, Y. H. / Kim, S. K. / Jeong, M. Y. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Contributors:

Koo, J. M. (author) / Lee, Y. H. (author) / Kim, S. K. (author) / Jeong, M. Y. (author) / Jung, S. B. (author) / Kim, Y.-J. / Bae, D.-H.

Published in:

Advances in Fracture and Strength ; 801-806

KEY ENGINEERING MATERIALS ; 297/300

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Chang, C.C. / Yang, S.C. / Chen, Y.J. et al. | British Library Online Contents | 2011

Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys

Choi, J.-W. / Cha, H.-S. / Oh, T.-S. | British Library Online Contents | 2002

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

Yeung, B. / Jang, J. W. | British Library Online Contents | 2002

Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

Koo, J.-M. / Yoon, J.-W. / Jung, S.-B. | British Library Online Contents | 2008

Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

Sharif, A. / Chan, Y. C. / Zhong, H. W. | British Library Online Contents | 2007