Reliability of BGA solder bumps Moire interferometry evaluates shock and vibration performance: Fid-Bau Portal

Reliability of BGA solder bumps Moire interferometry evaluates shock and vibration performance

Basaran, C. / Cartwright, A. / Zhao, Y. / Dishongh, T.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Reliability of BGA solder bumps Moire interferometry evaluates shock and vibration performance

Basaran, C. / Cartwright, A. / Zhao, Y. / Dishongh, T.

Reliability of BGA solder bumps Moire interferometry evaluates shock and vibration performance

Basaran, C. / Cartwright, A. / Zhao, Y. / Dishongh, T.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Reliability of BGA solder bumps Moire interferometry evaluates shock and vibration performance

Contributors:

Basaran, C. (author) / Cartwright, A. (author) / Zhao, Y. (author) / Dishongh, T. (author)

Published in:

ADVANCED PACKAGING ; 11 ; 47-58

Publication date:

2002-01-01

Size:

12 pages

ISSN:

1065-0555

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 658.564

Ye, H. / Basaran, C. / Hopkins, D. | British Library Online Contents | 2003

Vibration error-compensation technique in phase shifting moiré interferometry

Zhang, K. / Liu, Q. / Sun, C. et al. | British Library Online Contents | 2017

Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

Chung, S.-M. / Kim, Y.-H. | British Library Online Contents | 2007

High Temperature Moire Interferometry

Shi, L. | British Library Online Contents | 1997

Recent Applications of Moiré Interferometry

Ifju, P. G. / Han, B. | British Library Online Contents | 2010