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    Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

    New search for: Chung, S.-M.
    New search for: Kim, Y.-H.

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    Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

    New search for: Chung, S.-M.
    New search for: Kim, Y.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

    New search for: Chung, S.-M.
    New search for: Kim, Y.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

    Contributors:

    Chung, S.-M. (author) / Kim, Y.-H. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 48 ; 37-43

    Publication date:

    2007-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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