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    Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Ge, X.
    New search for: Liu, P.
    New search for: Liu, D.

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    Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Ge, X.
    New search for: Liu, P.
    New search for: Liu, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Ge, X.
    New search for: Liu, P.
    New search for: Liu, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

    Contributors:

    Tian, Y. (author) / Wang, C. (author) / Ge, X. (author) / Liu, P. (author) / Liu, D. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 95 ; 254 - 262

    Publication date:

    2002-01-01

    Size:

    9 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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