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Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface
Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface
Formation of intermetallic compounds at eutectic Sn-Zn-Al solder/Cu interface
Yu, S.-P. (author) / Wang, M.-C. (author) / Hon, M.-H. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 76-82
2001-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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