A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
Haba, T. (author) / Itabashi, T. (author) / Akahoshi, H. (author) / Sano, A. (author) / Kobayashi, K. (author) / Miyazaki, H. (author)
MATERIALS TRANSACTIONS ; 43 ; 1593-1598
2002-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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Molecular dynamics study of copper trench filling in damascene process
| British Library Online Contents | 2005