A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Molecular dynamics study of copper trench filling in damascene process
Molecular dynamics study of copper trench filling in damascene process
Molecular dynamics study of copper trench filling in damascene process
Hong, R. T. (author) / Huang, M. J. (author) / Yang, J. Y. (author)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 8 ; 587-601
2005-01-01
15 pages
Article (Journal)
English
DDC:
621.38152
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
| British Library Online Contents | 2002