A platform for research: civil engineering, architecture and urbanism
Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Tsujimura, M. (author) / Inoue, H. (author) / Ezawa, H. (author) / Miyata, M. (author) / Ota, M. (author)
MATERIALS TRANSACTIONS ; 43 ; 1615-1620
2002-01-01
6 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electroless metallization of carbon substrates
British Library Online Contents | 1999
|British Library Online Contents | 2016
|Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
British Library Online Contents | 2017
|Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
British Library Online Contents | 2017
|Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization
British Library Online Contents | 2017
|