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Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Ni-B Electroless Plating as Cap Layer for Ag Multi-Level Metallization
Tsujimura, M. (Autor:in) / Inoue, H. (Autor:in) / Ezawa, H. (Autor:in) / Miyata, M. (Autor:in) / Ota, M. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1615-1620
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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