Technology and Depositing Mechanism of Electroless Ni-P-Diamond Composite Plating: Fid-Bau Portal

Technology and Depositing Mechanism of Electroless Ni-P-Diamond Composite Plating

Xie, H. / Qian, K.-w. / Chen, W.-z.

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Technology and Depositing Mechanism of Electroless Ni-P-Diamond Composite Plating

Xie, H. / Qian, K.-w. / Chen, W.-z.

Technology and Depositing Mechanism of Electroless Ni-P-Diamond Composite Plating

Xie, H. / Qian, K.-w. / Chen, W.-z.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Technology and Depositing Mechanism of Electroless Ni-P-Diamond Composite Plating

Contributors:

Xie, H. (author) / Qian, K.-w. (author) / Chen, W.-z. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 35 ; 22-24

Publication date:

2002-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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