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Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Cao, J. L. / Wang, X. H. / Zhang, L. / Li, L. T.

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Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Cao, J. L. / Wang, X. H. / Zhang, L. / Li, L. T.

Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Cao, J. L. / Wang, X. H. / Zhang, L. / Li, L. T.

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Check availability in my library

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Document information

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Document information

Title:

Functional degradation of NiZnCu-based multilayer chip inductors during nickel electroplating

Contributors:

Cao, J. L. (author) / Wang, X. H. (author) / Zhang, L. (author) / Li, L. T. (author)

Published in:

MATERIALS LETTERS ; 57 ; 386-391

Publication date:

2002-01-01

Size:

6 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

European Patent Office | 2015

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