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    Growth mechanism of compound at interface of TC4/TC4 joint brazed with 72Ag-28Cu filler alloy

    New search for: Wu, M.-F.
    New search for: Yu, Z.-S.
    New search for: Jiang, C.-Y.
    New search for: Liangl, C.

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    Growth mechanism of compound at interface of TC4/TC4 joint brazed with 72Ag-28Cu filler alloy

    New search for: Wu, M.-F.
    New search for: Yu, Z.-S.
    New search for: Jiang, C.-Y.
    New search for: Liangl, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Growth mechanism of compound at interface of TC4/TC4 joint brazed with 72Ag-28Cu filler alloy

    New search for: Wu, M.-F.
    New search for: Yu, Z.-S.
    New search for: Jiang, C.-Y.
    New search for: Liangl, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Growth mechanism of compound at interface of TC4/TC4 joint brazed with 72Ag-28Cu filler alloy

    Contributors:

    Wu, M.-F. (author) / Yu, Z.-S. (author) / Jiang, C.-Y. (author) / Liangl, C. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 18 ; 1314-1316

    Publication date:

    2002-01-01

    Size:

    3 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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